Electronics Forum: disadvantages of water soluble flux (31)

Disposal of ultrasonic cleaning water

Electronics Forum | Tue Jun 24 12:26:33 EDT 2008 | dyoungquist

We are purchasing an ultrasonic cleaner to clean pcb asseblies that have been produced with water soluble flux based solder. After cleaning a batch of assemblies, the water in the cleaner will need to be disposed of. My question is: Do we need to

Removal of No-Clean flux residue

Electronics Forum | Thu Sep 06 10:58:54 EDT 2001 | Steve

If I had to deal with this problem, I would switch to water soluble paste. It is a much more cost effective solution.

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Industry News: disadvantages of water soluble flux (21)

Water-Based Flux Line Covers Full Range of Applications

Industry News | 2003-02-17 08:40:25.0

To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements

SMTnet

IPC and SMTA Announce Schedule for Session 4 of the High Performance Cleaning and Coating Conference

Industry News | 2010-10-11 14:57:11.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 4 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Association Connecting Electronics Industries (IPC)

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Technical Library: disadvantages of water soluble flux (3)

The Nature of White Residue on Printed Circuit Assemblies

Technical Library | 1999-05-07 10:47:00.0

White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.

Kester

Effect of BGA Reballing and its Influence on Ball Shear Strength

Technical Library | 2013-07-11 15:22:40.0

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).

MARTIN (a Finetech company)

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Express Newsletter: disadvantages of water soluble flux (414)


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